Semiconductor manufacturing is becoming more complex and challenging. Today's manufacturers must rely on efficient process monitoring – but conventional measuring methods alone can no longer guarantee the required quality standards.
This is why force, pressure and acceleration measurement is emerging as a critical factor in many front-end and back-end production processes: grinding, dicing, polishing, CMP, wafer handling, die sorting, wire bonding, flip-chip, molding and encapsulation, pick-and-place handling, testing – and many more. Piezoelectric dynamic measurement is the technology of choice to measure, monitor and control mechanical stress, vibration and pressure deviations in order to enhance quality assurance and productivity in semiconductor manufacturing.
Optimizing semiconductor production with monitoring technology from Kistler
Molding and encapsulation
Read more: Piezoelectric dynamic measurement in semiconductor manufacturing | Kistler
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